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Coin-Style PCB Heat Sinks

As power density goes up and packages get smaller, heat is getting harder to move. Thermal via fill helps, but on a lot of designs it isn't enough anymore.

That's the focus of our next webinar on October 20th, at 10:00AM PDT: coin-style heat sinks. 

A coin is a machined metal slug embedded directly into the bare board to pull heat straight down through the z-axis. Copper coins run around 400 W/m·K, roughly 50 times the conductivity of via fill, and they let you use lower-conductivity laminates in the rest of the stack.

We will cover:

The three build methods, embedded, plated aperture and metal-backed, and the cost and manufacturability tradeoffs of eachCoin geometries (I, T and W styles), shown with real cross sections and product samplesCritical dimensions, including flatness, coin-to-circuit and coin-to-edge clearances, hole diameters and annular ring, at both production and advanced tolerancesHow to call out coins in your print notes and GerbersThe common risk factors, like mixing coin geometries, tight trace and via spacing nearby, and overly complex shapes

If you're working on anything with real thermal load, this is worth an hour. And if you can't make it live, register anyway and we'll send you the recording.

When:  October 20th, 2026
Where:  Your Desk
Time: 10:00am PDT

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